Semiconductor Package Board Testing System Utilizing Index Table Method
The 1231-11 is an IC package board tester that features high-precision, large-pin capabilities for high-density, fine-pitch boards.
• Index table method
Index-type system simultaneously supplies, aligns, tests, and ejects boards, providing wait-free multitasking performance.
• Support for probing fine patterns
High repeatability makes it possible to probe within an area with a diameter of 10 μm.
• Support for high-density wiring boards
The 1231-11 can perform 4-terminal testing of high-density wiring boards with up to 16,384 pins (200% more than previous models).
• Intuitive user interface
Easy-to-understand icons facilitate intuitive operation. The 1231-11 also supports graphical display of electronic component connection information.
• Flip-chip solder bump profile testing
The 1231-11 supports combined testing with Zygo-manufactured systems.
■ Specifications overview
|Maximum number of pins||Max. 16,384 (max. 12,288 on top and max. 4,096 on bottom)
Standard: 4,096 pins (8 scanner boards each for top and bottom for a total of 4,096 pins)
|Number of test steps||Max. 10,000 steps|
|Cycle time||1.5 sec./piece
(1,024 points, continuity testing, isolation testing, 2 points per pattern, measuring a PASS board)
|Minimum pad diameter||φ 10 μm|
|Probe working area||610 mm (24.02 in) W × 510 mm (20.08 in) D|
|Clampable/transportable board dimensions||Thickness: 0.3 to 2.5 mm (*Standard specifications: 0.8 to 2.5 mm)
Outer dimensions: 13 mm (0.51 in) W × 13 mm (0.51 in) D to 75 mm (2.95 in) W × 75 mm (2.95 in) D (*Standard specifications: Up to 55 mm (2.17 in))
|Inter-probe pitch||Min. 80 μm|
|Power supply||200 V AC ±10% (3-phase), 50/60 Hz, 6 kVA|
|Dimensions and mass||1,500 mm (59.06 in) W × 1,680 mm (66.14 in) H × 1,750 mm (68.90 in) D, 2,000 kg (70,546.7 oz)|